Detects depth and surface uniformity of etched structures on printed circuit boards.
Accurate height and surface detection of solder pads on flexible PCBs.
Measures micro-scale LED substrates for flatness and placement accuracy.
Captures 3D profile of through-holes for diameter and defect analysis.
Non-contact measurement of aluminum cooling structures with high repeatability.
Identifies scratches, bumps, or deformation on circuit boards.
Comprehensive inspection at different manufacturing stages of smartphones.
Inspects mechanical accuracy of hole-punched phone displays.
